ULTRASONIC TESTING (UT)
Bond Testing and BondMaster Probes
Bond Testing Flaw Detectors
Our complete line of bond testing (BT) flaw detectors provides unmatched capabilities for the location of discontinuities and other flaws in composite structures. We offer a wide range of measurement features and application-specific options for flaw detection. Some of the primary applications include the location, identification and sizing of dis-bonds, delamination, and repair (putty) areas of honeycomb composite and composite laminates in aircraft structures (wings and flaps), high-performance racing vehicles, and boat hulls.
BondMaster 600
The portable BondMaster 600 delivers a powerful combination of multimode bond testing software and highly advanced digital electronics for the nondestructive inspection of honeycomb and laminate composites and metal-to-metal bonds.
OmniScan MX ECA/ECT
The Bond Testing C-Scan inspection solution is based on the OmniScan MX with ECT or ECA modules. This innovative solution increases the probability of detection of the pitch-catch bond testing method, as it produces live amplitude or phase C-scan images with up to 8 frequencies.
35RDC
The 35RDC is a simple Go/No-Go ultrasonic gage designed to detect subsurface defects caused by impact damage on aircraft composite structures. Features a backlit LCD that displays the word GOOD if no subsurface damage is found or the word BAD when it detects subsurface damage.
BondMaster Probes
BondMaster probes include a wide variety of versatile probes such as pitch-catch, MIA (mechanical impedance analysis), and resonance probes.
BondMaster Probes
Our bond testing probes feature a versatile variety of detection technologies, including pitch-catch, mechanical impedance analysis (MIA), and resonance probes, each type addressing a specific bond testing application. Compatible with the BondMaster 600 multimode bond tester, our bond testing probes—available in kits or individually—enable reliable and efficient detection of disbonding in honeycomb and laminate composites as well as metal-to-metal disbonds. Explore these product pages below to determine which probe type is ideal for your application.
Please note that product availability varies by region. Contact your local Evident sales office for more information.
Pitch-Catch Probes
Pitch-Catch probes are ideal to detect skin-to-core disbond in composite honeycomb. The broadband probe crystals allow scanning over a wide range of composite thicknesses.
Mechanical Impedance Analysis (MIA) Probes
Mechanical Impedance Analysis probes are best to detect smaller skin-to-core disbond on composite honeycomb. They are also a great tool to identify repaired (potted) areas.
Resonance Probes
Resonance method is ideal to detect delamination in composite laminates or inspect metal-to-metal bonding. Resonance probes come in various frequencies to accommodate the wide range of composite thicknesses and ply structure found in the industry.
BondMaster Probe Kits
BondMaster probe kits feature common kits approved in various procedures and work instructions.
